Modeling Thermal Fatigue in Anisotropic Sn-Ag-Cu/Cu Solder Joints

摘要：

Properties of body-centered tetragonal β-Sn are highly anisotropic. The crystal orientation of the β-Sn has a marked effect on the stress state in the SnAgCu solder joints. A finite element analysis has been performed of the thermal cycling of the SnAgCu solder and solder joints. Significant amounts of stresses at the solder/Cu interface and in the plane of the grain boundary was found. The best Sn grain orientation is perpendicular to the solder/Cu interface.

作者: Shihua Yang Yanhong Tian Chunqing Wang Tengfei Huang

作者单位: Department of Electronics Packaging Technology, School of Materials and Engineering State Key Lab of Advanced Welding Production TechnologyHarbin Institute of Technology, P.O. Box 436,

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 288-289

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）