Simulation of Fluid Flow and Heat Transfer in Microchannel Cooling for LTCC Electronic Packages

摘要：

The hydrodynamic and thermal characteristics of microchannel networks are investigated by finite element analysis with commercial software Fluent. The simulation model is based on fabricated thick film LTCC substrate with 3D cooling microchannels. A comparison of the cooling performance among fractal-shaped microchannel, parallel microchannel, serpentine microchannel, spiral microchannel is also conducted numerically based on the same heat flux and the same mass flow rate. It is found that fractal-shaped microchannel facilitates the lowest fluid pressure drop and the most uniform temperature distribution over the substrate, and that the spiral microchannel network enables the smallest temperature rise.

作者: J.Zhang Y.F.Zhang M.Miao Y.F.Jin S.L. Bai J.Q. Chen

作者单位: SHENZHEN Graduate School Of PeKing University National Key Laboratory on Micro/Nano Fabrication Tech Department of Advanced Materials and Nanotechnology, Peking University, Beijing, CHINA National Key Laboratory on Micro/Nano Fabrication Technology, Peking University, Beijing, CHINA Info National Key Laboratory on Micro/Nano Fabrication Technology, Peking University, Beijing, CHINA

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 327-330

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）