Research of Methodologies to Enlarge the Isolation in 3D Interconnection

摘要：

As the speed of digital systems continues to increase, digital design has entered a new realm that requires high integration and high complexity with limited dimension. Different from the parameter analysis in low frequency which mainly focuses on resistances and their effects, the coactions of resistances, inductances and capacitances are all needed to be taken into account in high frequency. This paper uses finite element method (FEM) to analyze the coupling and isolation of three types of structures, and presents a measure for the purpose of improving the performance of TSV.

作者: Liwei Zhao Long Yang Xin Sun Yufeng Jin

作者单位: National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, 100871, P. Ansoft, 22F/04C Office Tower, Bund Center, 222 Yan An Road (East) Shanghai, 200002

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 331-334

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）