Influence of Strain Rate Effect on Behavior of Solder Joints under Drop Impact Loadings

摘要：

The strain rate dependent Johnson-Cook material model and the rate independent elastic-plastic model of lead-free solders were used to investigate influence of strain rate effect on the mechanical behavior of solder joints under drop impact loadings. Failure of the solder joints was predicted and the results were compared with the experimental observations. The strain rate effect of lead-free solders has no influence on the deflection of the PCB during the drop impact but has significant influence on the stress and strain in solder joints. The rate independent elastic-plastic solder material model always underestimates the stress and overestimates the strain of the solder joint. The material model that takes the strain rate effect into account can predict more realistic behavior of the solder joints.

作者: Tong AN Fei QIN Jiangang Li

作者单位: College of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technolog College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technolo

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 375-378

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）