A Core-Shell Structure Viscoelastic Model of Particulate-Filled Electronic Packaging Polymers
On the basis of structural and mechanical characterization of particulate-filled epoxy materials, a new core-shell structure viscoelastic constitutive model is established for predicting mechanical performances of particulate-filled electronic packaging materials in this paper. The threephases( layers) of core-shell particle and matrix constitute the core-shell structure model and the modified Kelvin viscoelastic model was combined with the structure model, which improve the mechanical propertys calculation of electronic packaging polymers. With this model, the relationship between mechanical properties of the electronic packaging materials and modulus of matrix, solid particles content, particle size, gradation and modulus of the intermediate shell layer were constructed mathematically and analytical modeling of tensile strength and elongation of particle-filled electronic packaging polymers was conducted. The results show that the predictions of this model is in good agreement with experimental measurements for both tensile strength and elongation of particulate-filled electronic packaging materials.
Dayong Gui Jianhong Liu Bo Chen Xin Miao Guangfu Zeng Deyu Tian
School of Chemistry and Chemical Engineering, Shenzhen University, Shenzhen, 518060, P.R.China
国际会议
北京
英文
388-392
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）