FEM Study on the Effects of Flip Chip Packaging Induced Stress on MEMS

摘要：

Packaging induced stress may have considerable effect on performance of MEMS devices. This paper is focused on the performance change of MEMS devices after flip chip package. The warpage and stress distribution on die surface of flip chip package with different bumps layout are investigated using finite element method(FEM). Package of 4×4 all-array pattern is first studied. Then a comparison study between packages with bumps of 2×2,4×4 and 6×6 all-array patterns and one-circle 4×4, one-circle 6×6 and two-circle 6×6 peripheral patterns are presented. According to the FEM results, the packaging effect on the natural frequency of a flipchipped microcbridge is case studied finally.

作者: Songsheng Wei Jieying Tang Jing Song

作者单位: Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing, 210096, China

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 403-406

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）