High Bright White LED Lens Formation by Vacuum Printing Encapsulation Systems (VPES) and Its Packaging Resin

摘要：

White color LED has been investigated for lighting application with a big expectation of growth. And in terms of packaging of them in general, clear transparent epoxy resin has been mainly used in spite of problems such as coloring of the resin due to high temperature and UV light emitted from Chip itself. In order to solve this problem, we have investigated new materials such as silicon resin and specially modified epoxy resin etc. And then we would suggest that materials should be chosen depending upon LED specifications, packaging materials and also reliability test conditions etc. In addition we would like to suggest high density packaging technology using VPES, which meets very fine pitch, high density packaging designs, and meets cost effective mass production.

作者: Atsushi Okuno Osamu Tanaka

作者单位: 3–5–1, 3–Chome, Doucho, Takatsuki-City, Osaka, JAPAN

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 448-450

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）