Nano Resonator Simulation Fabrication and Packaging Consideration

摘要：

A study on simulation, fabrication and packaging of metallic nano resonator is presented. The nano resonator is modeled with an equivalent circuit and simulated using HSPICE. CMOS compatible process is used to fabricate the nano resonator with a minimum modification The suspended part of the device is released using HF vapor-phase etching. Packaging of nanoscale device is conceived based on the features, fabrication process and the application of the nano resonator.

作者: Wei Zhang Zewen Liu Zheng Wang

作者单位: Institute of Microelectronics, Tsinghua UniversityBeijing, 100084, China Institute of Microelectronics, Tsinghua University Beijing, 100084, China

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 508-511

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）