Growth Kinetics and Microstructural Evolution of Cu-Sn Intermetallic Compounds on Different Cu Substrates during Thermal Aging

摘要：

The microstructure of the eutectic SnBi/Cu interface was investigated by transmission electron microscopy (TEM). Insitu and ex-situ thermal aging were conducted to study the nucleation and growth of Cu3Sn and Cu6Sn5 on both polycrystalline and single crystalline Cu substrates. The growth kinetic analysis showed that although the growth of total IMCs (Cu3Sn + Cu6Sn5) was similar on single and polycrystalline Cu substrates, the Cu3Sn grew faster on polycrystalline Cu substrate than that on single crystal Cu substrate, while Cu6Sn5 grew slowly on polycrystalline Cu during thermal aging.

作者: Z.Q. Liu P.J. Shang D.X. Li J. K. Shang

作者单位: Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 569-571

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）