Microstructural Characterization of Electroplating Sn on Lead-frame Alloys

摘要：

Electroplating Sn plays an important role in the lead-free age because of its excellent solderability and many other advantages. In this work, bright Sn was electroplated onto both C194 and FeNi42 alloys. The plating parameters, substrate effect, barrier layer effect and IMC formation were investigated through detailed microstructural characterization of the Sn films, barrier layers and cross-sections. It was found that the current density, plating time, substrate type and barrier layer play an important role in determining the fine structures of the Sn deposition. Interfacial reactions to form intermetallic compounds (IMC) was also observed. Replacing the traditional Ni barrier with Ni nanocone barrier was found to result in a quite different IMC formation/distribution.

作者: Yiqing Wang Dongyan Ding Klaus-Peter Galuschki Yu Hu Angela Gong Shuo Bai Ming Li1 Dali Mao

作者单位: Lab of Microelectronic Materials & Technology, School of Materials Science and EngineeringShanghai J SMT Technology & Material, Corporate Technology, Siemens Ltd., China Lab of Microelectronic Materials & Technology, School of Materials Science and Engineering Shanghai

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 601-606

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）