Effect of Cu Addition in Sn-containing Solder Joints on Interfacial Reactions with Au Foils

摘要：

Pure Sn, Sn-0.7Cu, Sn-1.5Cu and Sn-3.0Cu solder joints were fabricated by a laser reflow soldering method, and then they were aged at 125℃ for various periods. After 600 hours treatment, we found that thickness of Intermetallic Compounds (IMCs) in the pure Sn solder joints was 54μm. However, in the solder joints with Cu addition, formation of AuSn4 IMCs was inhibited, and other two kinds of Sn-Cu-Au ternary phases were found in stead. In the Sn-3.0Cu solder joints, the IMCs and phases were only 34μm in thickness, moreover, growth of the IMCs and phases did not follow the parabolic law.

作者: Wei Liu Chunqing Wang Lining Sun Yanhong Tian Yarong Chen

作者单位: Department of Electronics Packaging Technology,State Key Lab of Advanced Welding Production Technolo Department of Electronics Packaging Technology,State Key Lab of Advanced Welding Production Technolo Mechanical Engineering Post-Doctoral Mobile Research Station,436＃, Harbin Institute of Technology,92

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 642-645

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）