Evolution of Ag3Sn Compounds in Solidification of Eutectic Sn-3.5Ag Solder

摘要：

The relation between cooling rate and morphology of Ag3Sn IMCs was investigated in this study. The morphology of Ag3Sn intermetallic compounds of eutectic Sn-3.5Ag solder was investigated after solidification at different cooling rates. As the nucleation time of Ag3Sn depended on cooling rate, the morphology and size of Ag3Sn compounds were affected by cooling rate. The three types of Ag3Sn compound during different cooling rate solidification were found to be particle-like, needle-like, and plate-like in Sn-3.5Ag solder. The results show that as the cooling rate decreases, the morphology of Ag3Sn formed in Sn-3.5Ag solder transforms progressively from particle-like to plate-like.

作者: Hwa-Teng Lee Yin-Fa Chen Ting-Fu Hong Ku-Ta Shih

作者单位: Department of Mechanical Engineering, Cheng Kung University,1, University Road, Tainan 70101, Taiwan Department of Materials Engineering, Pingtung University of Science and Technology,1, Hseuhfu Road,

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 646-649

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）