Liquid-state Interfacial Reactions between Sn-Ag-Cu-Fe Composite Solders and Cu Substrate
Growth kinetics and interfacial morphologies of the intermetallic compound (IMCs) between Sn-3Ag-0.5CuxFe( 0, 0.5wt.％, 1wt.％) composite solders and Cu substrates were investigated by reflowing for different durations at 250℃. Fe particles were deposited quickly in the vicinity of IMCs of the as-reflow samples due to the higher density of Fe than that of Sn-Ag-Cu. They formed a region about 30μm wide where the volume percentage of Fe particles could reach 19％. The isothermal equation of chemical reaction and phase diagrams is used to explain the effect of Fe on the growth kinetics of IMCs under liquid-state conditions. It is found that Fe can effectively retard the growth of Cu6Sn5 and Cu3Sn during liquid-state aging and reduce the size of Cu6Sn5 particles. Some local small cracks were observed in the Cu6Sn5 particles near interfaces of SAC solder alloys after reflowing for about five minutes. Such cracks were found in the other composite solders only thirty minutes reflow.
Xiaoying Liu Yanhui Zhao Mingliang Huang C.M.L.Wu Lai Wang
Department of Materials Engineering, Dalian University of Technology 116023, P. R. C Department of Physics and Materials Science, City University of Hong Kong, Hong Kong
国际会议
北京
英文
687-690
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）