Cure Kinetics Analysis and Simulation of Silicone Adhesives

摘要：

A nonlinear transient heat transfer finite element model based on commercial finite element software, ABAQUS, is developed to simulate the curing process of silicone adhesive. The curing reaction process and specific heat of the silicone adhesive were investigated using a differential scanning calorimetry (DSC) to obtain material parameters for numerical simulations. Curing reaction kinetics was derived. Using the user subroutine HETVAL of ABAQUS, temperature distributions inside silicone can be evaluated by solving the heat conduction equations including internal heat generation produced by curing reactions. Good agreement between experimental data and numerical analysis by ABAQUS is obtained.

作者: Qin Zhang Bin Song Simin Wang Ling Xu Sheng Liu

作者单位: School of Mechanical Science and Engineering, Huazhong University of Science and TechnologyWuhan, Hu Wuhan National Laboratory for Optoelectronics Division of MOEMSWuhan, Hubei, 430074, China School of Materials Science & Engineering, Huazhong University of Science and TechnologyWuhan, Hubei School of Mechanical Science and Engineering, Huazhong University of Science and Technology Wuhan, H

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 691-694

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）