Creep Characterization of Lead Free 80Au-20Sn Solder

摘要：

In this paper, steady-state creep behavior of lead free 80Au-20Sn solder was investigated at three different temperatures (i.e. 25℃, 75℃ and 125℃) and a range of stress levels. Hyperbolic-Sine model was employed to characterize the creep properties of the lead free solder, constants in the model were determined through data fitting and were compared with that of other lead free solders.

作者: Fei Su Haiyan Pan

作者单位: Institute of Solid Mechanics, Beijing University of Aeronautics and Astronautics37 Xueyuan Road, Bei Institute of Solid Mechanics, Beijing University of Aeronautics and Astronautics 37 Xueyuan Road, Be

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 718-721

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）