The Warpage Control Method in Epozy Molding Compound

摘要：

This paper is to study the warpage impact of filler content and special additives on BGA packages. The special additives have significant impact on the warpage. The additive A has great influence on the warpage at different temperature; the warpage will flatten when more additive A is added. From the warpage study of single unit from room temperature to 260℃, all the warpage is in 50um when additive A is about 1％. The additive A can flatten the warpage of the package and keep the warpage at same level even with different silicon occupation in the package. The filler content shows great impact on the warpage by control the shrinkage after cured, the lower shrinkage; the package will move to more crying.

作者: Wei Tan Fang Zhou Xingming Cheng Dong Ding Juan Wu

作者单位: Henkel Huawei Electronics Co., Ltd.Songtiao Industry Park, Lianyungang, Jiangsu, China, 222006 Henkel Huawei Electronics Co., Ltd. Songtiao Industry Park, Lianyungang, Jiangsu, China, 222006

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 722-724

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）