Dynamic Constitutive Relation of EMC over a Broad Range of Temperatures and Strain Rates

摘要：

In this paper, dynamic properties of EMC were studied sat different temperatures and different strain rates. Firstly EMC was investigated by quasi-static tests. Secondly a series of dynamic compressive experiments of EMC were conducted using the Split Hopkinson Pressure Bar (SHPB) at high strain rates. Corresponding measurements were conducted at temperatures ranging from 20℃ to 200℃. The results indicate that the yield strength and flow stress of EMC increase remarkably with the increase of strain rate. However, the yield strength of EMC is almost unchanged with the increase of temperature which is ranging from 20℃ to 200℃.

作者: Tong Chen Xiaoyan Niu Xuefeng Shu Jianwen Zhang

作者单位: Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of TechnologyNo.79 West Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of TechnologyNo.79 West Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology No.79 West

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 733-736

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）