Preliminary Study of a New Process to Improve the Strength of Thermo-sonic Ball Solder Joint
The separation of golden ball and die pad due to the poor bonding strength of 1st ball solder point is the main failure mode in thermo-sonic ball wire bonding. In this paper, nonlinear elastic and elasto-plastic quasi-static analysis of FAB (free air ball) in ultrasonic vibration process is carried out by finite element method with ANSYS. We study the evolution way of compressive stress distributions of FAB and sliding area in the contact interface under elastic and elastoplastic deformation. According to the results of the analysis and the mechanism of micro-slip based on elastic theoretical assumption, we propose a new bonding process control that can improve the bonding strength of 1st ball solder point effectively.
Zhai Yu Zhao Wang Jun Cheng Hw Tian
ShenZhen Institute of Advanced Integration TechnologyChinese Academy of Sciences and The Chinese Uni ShenZhen Institute of Advanced Integration TechnologyChinese Academy of Sciences and The Chinese Uni School of Mechanical Engineering, Southwest Jiao Tong University, Chengdu, 610031, China,
国际会议
北京
英文
742-748
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）