Nanoindentation Investigation of Copper Bonding Wire and Ball
Copper is the most cost-effective alternative to gold which is used in wire bonding. Hardness of bonding wire and FAB (free air ball) is double-edged swords, wire with higher hardness and strength can build more reliable loop, but damage the bounding pad on the chip more easily. Precisely measuring hardness is meaningful for improving the performance and reliability of the bonding process. Nanoindenter is a powerful experimental technique for detecting mechanical properties of materials. In this work, the mechanism of nanoindentation and the selection of hardness test parameters were studied. Hysitrons nanoindenter with Berkovich tip was used to measure hardness of 0.8mil (20μm) 4N(99.99％wt of copper) copper ball bonding wire, FAB and bonded ball. It is confirmed that copper wires get harder mainly in ball formation and ball bond form process.
Xiangquan Fan Kaiyou Qian Techun Wang Yuqi Cong Mike Zhao Binhai Zhang Jiaji Wang
Department of Material Science, Fudan University, No. 220, Handan Road, Shanghai, 200433, China ASE Assembly & Test (Shanghai) Limited, No. 669, Guoshoujing Road, Shanghai, 201203, China
国际会议
北京
英文
790-794
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）