Parameter Design of Solder Die Bonding Based on DOE

摘要：

In this paper, DOE methodology was used to set parameters that may exert an influence on voids in the solder layer of MOSFETs products. Parameters of temperature and delay-times were set. With different parameters, voids rate in solder layer changes. Finally we can find the main factor affecting voids rate, thus to reduce the voids rate in solder layer and get high-powered semiconductor device.

作者: Jun Hu Xinpeng Xie

作者单位: Guangdong Yuejing High-Tech Co, Ltd, No.10,Nan Xiang 2Rd. Science City, Guangzhou, China, 510663 South China University of Technology, Guangzhou Higher Education Mega centre, Guangzhou, China, 5100

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 799-801

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）