Outgassing of Materials Used for Thin Film Vacuum Packages

摘要：

In this paper, outgassing of the thin film vacuum package is analyzed by integrated MEMS (Microelectromechanical system) resonator and RBS (Rutherford backscattering spectroscopy). Outgassing behavior of different thin film packaging materials is studied by exodiffusion experiments. It is demonstrated that a high temperature pre anneal will greatly reduce the outgassing but can not eliminate it.

作者: Q. Li J.F.L. Goosen J.T.M. van Beek F. van Keulen G.Q. Zhang

作者单位: Materials innovation institute, Mekelweg 2, 2600GA, Delft, The Netherlands Department of Precision a Department of Precision and Microsystems Engineering, Delft University of Technology,Mekelweg 2, 262 NXP Semiconductors, Eindhoven, The Netherlands Department of Precision and Microsystems Engineering, Delft University of Technology, Mekelweg 2, 26

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 802-806

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）