Al/Ni Multilayer Used as a Local Heat Source for Mounting Microelectronic Components
This paper describes a novel local heating technique for microelectronic mounting. Aluminum/nickel (Al/Ni) multilayer foils show self-propagating exothermic reactions, driven by a reduction in atomic bond energy which can provide rapid bursts of heat and can act as a local heat source to melt solder layers and join materials. In this work, we demonstrate the validity of the Al/Ni reactive foils as a heat source in microelectronic mounting by joining a tiny sheet coppers to a printed circuit board. The Al/Ni multilayer was made by cooled rolling. Thermal analysis of the exothermic reactions in Al/Ni multilayer films was made to make sure that the bonding process is feasible theoretically. The interface of the bonding and the reaction product of the reactive Al/Ni foils was characterized by using Scanning Electron Microscope (SEM) and Energy Dispersive X-ray Detector (EDX).
Jun Zhang Feng-shun Wu Jian Zou Bing An Hui Liu
Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology,Wuhan, Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan,
国际会议
北京
英文
838-842
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）