Effects of the Matriz Shrinkage and Filler Hardness on the Thermal Conductivity of TCA
Thermal conductive adhesives (TCA) have been widely used as the thermal interface material (TIM). The TCA are usually epoxy or silicone based mixtures containing fillers. The epoxy in TCA also applies a pressure on the filler particles as it shrinks during the curing process. This pressure leads to an increase in the contact area between the filler particles and thus improves the thermal conductivity. In our attempt to discover the effect of filler modulus on the contact areas between two particles we constructed a cell model assay. In order to study the different epoxy characteristics, 28 cases were simulated with different mixtures of epoxy and filler. The thermal conductivity of each case was calculated by FEM. When the shrinkage was higher than 1％, TCA with a filler modulus of 83Gpa (silver) has the largest contact area, which suggests silver has the best TCA performance among the studied materials. Furthermore the viscoelasticity of the epoxy was simulated to evaluate the fully relax time of epoxy and the effect on the thermal conductivity of TCA.
Cong Yue Yan Zhang Zhili Hu Johan Liu Zhaonian Cheng
Key Laboratory of Advanced Display and System Applications, Ministry of Education, SMIT CenterSchool Key Laboratory of Advanced Display and System Applications, Ministry of Education, SMIT CenterSchool Key Laboratory of Advanced Display and System Applications, Ministry of Education, SMIT Center Schoo
国际会议
北京
英文
851-855
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）