Electroless Plating of Copper Nano-coned Array for High Reliability Packaging

摘要：

Nano-coned array of Cu were prepared by electroless plating with special crystallization conditioning agent. The morphologies of nano-coned array were observed by FESEM. The influences of active time in PdCl2, concentration of NiSO4·6H2O, crystallization conditioning agent, pH and temperature of plating solution were discussed. Then, the possible reasons of the influence on the growth of nano-coned array were investigated. NiSO4·6H2O was proved as catalytic active agent. The optimum preparation conditions were fixed. The crystal crystallographic orientation and elements of the nano-coned array were measured using TEM and EDX. The nano-cones consist of 95.57％ copper and 4.43％ nickel. The crystal crystallographic orientation of them is typical copper FCC single crystal.

作者: Zhongwen Pan Anmin Hu Tao Hang Yingying Duan Ming Li Dali Mao

作者单位: Lab of Microelectronic Materials & Technology, School of Materials Science and Engineering,Shanghai Lab of Microelectronic Materials & Technology, School of Materials Science and Engineering, Shanghai

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 867-871

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）