Study of Interfacial Reactions between Sn3.5Ag0.5Cu Alloys and Cu Substrate

摘要：

Interfacial reactions between Sn3.5Ag0.5Cu lead-free solders (SAC) and Cu were investigated during soldering reactions between liquid SAC and Cu substrate at 250, 260, 275, 300 and 325℃ for various reaction times. Experimental results show that a scallop-shaped layer of Cu6Sn5 intermetallic compounds formed during the soldering. Kinetics analysis shows that the growth of such interfacial Cu6Sn5 intermetallic compounds is diffusion controlled with an activation energy of 65.69 kJ/mol. This interesting behavior of IMC dissolution is attributed to the relatively high solubility of Cu in liquid solders.

作者: L. C. Tsao S. Y. Chang W. H. Sun S. F. Yen

作者单位: Department of Materials Engineering, Pingtung University of Science & Technology, Taiwan, China Department of Mechanical Engineering, Yunlin University of Science & Technology, Taiwan, China Microsystems Technology Center, Industrial Technology Research Institute, Taiwan, China1, Hseuhfu Ro

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 886-889

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）