On Variable Frequency Microwave Processing of Heterogeneous Chip-on-Board Assemblies
Variable Frequency Microwave (VFM) processing of heterogeneous chip-on-board assemblies is assessed using a multiphysics modelling approach. The Frequency Agile Microwave Oven Bonding System (FAMOBS) is capable of rapidly processing individual packages on a Chip-On-Board (COB) assembly. This enables each package to be processed in an optimal manner, with temperature ramp rate, maximum temperature and process duration tailored to the specific package, a significant benefit in assemblies containing disparate package types. Such heterogeneous assemblies may contain components such as large power modules alongside smaller modules containing low thermal budget materials with highly disparate processing requirements. The analysis of two disparate packages has been assessed numerically to determine the applicability of the dual section microwave system to curing heterogeneous devices and to determine the influence of differing processing requirements of optimal process parameters.
T. Tilford S. Pavuluri C. Bailey M. P. Y. Desmulliez
School of Computing and Mathematical Sciences, University Of Greenwich, Park Row,Greenwich, London, MicroSystems Engineering Centre (MISEC), School of Engineering & Physical Sciences,Earl Mountbatten MicroSystems Engineering Centre (MISEC), School of Engineering & Physical Sciences, Earl Mountbatten
国际会议
北京
英文
927-931
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）