A Jetting System for Chip on Glass Package
Jetting is regarded as the next generation dispensing technology due to its features of non-contact and high precision dispensing. In this paper, we developed a jetting system for chip-on-glass package consisting of a jetting dispenser and a 3-axis movement system. The jetting dispenser applied a concept of modular design to construct four modules, which were nozzle, actuator, feeder and temperature controller. To analyze the factors influencing the fluid jetting, the proper fluid and structure models were set up. In the jetting dispenser, we used a solenoid valve (f >100Hz) to provide a high-speed movement for a needle. In a dispensing process, a piston drove a needle to move reciprocate, and its stroke was measured and controlled by a micrometer. A 3-axis system was a platform for the installation of jetting dispenser, and supported a reciprocating motion to follow the programmed route.
Haili Jia Zikai Hua Maoyu Li Jinsong Zhang Jianhua Zhang
School Engineering and Engineering and Automation, Shanghai University, Shanghai City, 200072 Key Laboratory of Advanced Display and System Applications of Ministry of Education, Shanghai Univer
国际会议
北京
英文
954-960
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）