会议专题

Design and Modeling of Jet Dispenser Based on Giant Magnetostrictive Material

The rapid development of microelectronics packaging technology drives the development of packaging equipment manufacturing industry. As an important equipment of packaging technology, fluid dispensing system is developed rapidly. Non-contact jet dispensing is the latest technology of dispensing technology. Compared to the conventional contact dispensing methods, jet dispensing technology is a noncontact method and has the following advantages: (1) it has high flow rate, high dispensing frequency; (2) This method neednt z-axis motion; (3) it has high dispensing accuracy and smaller wet area; (4) Needle bending and Chip surface damage situation does not arise. In this paper, we design a non-contact jet dispensing device based on giant magnetostrictive material. The giant magnetostrictive material (GMM) is a new type of function material with giant strain, high response speed, high power density and great output force. For this jet dispenser, the GMA (Giant Magnetostrictive Actuator) provides the driving force of dispensing. Because the magnetostrictive coefficient of GMM is small, we design a displacement amplifying mechanism with flexure hinges to amplify the output displacement of giant magnetostrictive actuator. The structure and principle of jet dispenser with a displacement amplifying mechanism are presented. In order to obtain the dynamic characteristics of the jet dispenser, its dynamic model and the transfer function block diagram of dispenser between excitation current and output displacement is established. The jet dispensers dynamic characteristics are simulated though the use of matlab. The amplitude-frequency response characteristics and dynamic characteristics is obtained. The amplifying ratio N ( N=l2/l1 ) of displacement amplifying mechanism is verified, in this paper, the amplifying ratio N is 5.

Zhiqi Ge Guiling Deng

Key Laboratory of Modern Complex Equipment Design and Extreme manufacturing, CentralSouth University Key Laboratory of Modern Complex Equipment Design and Extreme manufacturing, Central South Universit

国际会议

2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

北京

英文

974-979

2009-08-10(万方平台首次上网日期,不代表论文的发表时间)