Automatic Plating Technology for Ceramic Packaging
The plating technology meets many difficulties due to the shape variety, frame complexity and material diversity of the ceramic packages. Nowadays much of the plating still relies on handwork, which limits both the batch production and quality stability of ceramic packages. One method to solve the problem is the automatization of plating by using advanced equipments, stable plating process and control methods. Therefore, in the paper the automatic plating for ceramic package was reported in three aspects, i.e., plating equipments, plating process and control methods. The technique of this work has been successfully applied in practical production, and supported batch production of ceramic packages. The increasing demand on the production of ceramic packages requires more advanced techniques, among which plating is one indispensable process. The automatization plating technique can benefit the batch production of ceramic packages, though it is difficult to be realized due to the variety or even non-standard requirement of ceramic packages. Especially in the batch production of mixed types of packages, the different configurations, surface materials and plating procedures have high requirements on the automatization process. Only the production line that combines with multi-processes in a range of operational parameters can take full advantage of the automatization method. Thus, in this paper, the development of automatic production lines for plating ceramic packages was reported according to the plating equipment, plating process and control method.
Congge Lu Shengqian Liu Lei Zhang
Hebei Semiconductor Research InstituteP. O. Box 179-41, Shijiazhuang Hebei, P. R. China
国际会议
北京
英文
986-988
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）