Advanced Moisture Diffusion Model and Hygro-Thermo-Mechanical Design for Flip Chip BGA Package
In the present paper, a comprehensive moisture diffusion model and characterization for encapsulated plastic Flip Chip (FC) Ball Grid Array (BGA) package are investigated. The transient moisture diffusion analysis described by Ficks second law is performed to evaluate the overall moisture distribution. Diffusivities in the moisture desorption model are determined under Arrhenius behaviors. Hygroscopic swelling properties of polymeric materials are characterized by using an existing TMA/TGA extraction method. With the so-calledthermal-wetness analogous technique, finite element analysis (FEA) is developed to evaluate the entire moisture distribution on FC BGA package. The analytical expression for total expansion strain due to hygro-thermo-mechanical coupled effect is implemented using finite element software ANSYS. Finite element predictions reveal the significance of contribution of hygroswelling induced strain. Reliability analysis for FC BGA is performed in accordance with JEDEC standard JESD22-A120.A series of comprehensive experimental works and parametric studies are conducted in this research.
Ming-Han Tsai Feng-Jui Hsu Meng-Chieh Weng Hsiang-Chen Hsu
Department of Mechanical and Automation Engineering, I-Shou UniversityNo. 1, Sec. 1, Syuecheng Rd., Dashu Township, Kaohsiung County, Taiwan 84008
国际会议
北京
英文
1002-1008
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）