Effects of Thermal Aging on the Electrical Resistance of Sn-3.5Ag Micro SOH Solder Joints

摘要：

The relationship among the electrical resistance, the thickness of the IMC layer and the aging timer of the micro SOH solder joints is investigated in present paper. Its found that the composition of compositions of the intermetallic compounds are Cu3Sn near the Cu side and Cu6Sn5 near the solder side; With the increasing of aging time, the thickness of the Cu3Sn increased while the thickness of the Cu6Sn5 decreased. The total thickness of IMCs (Cu6Sn5 and Cu3Sn) increased as the aging time increased, while the resistance of the micro SOH solder joints increased at first and then decreased. The resistance of solder joints increased at first and then decreased as the total thickness of IMCs (Cu6Sn5 and Cu3Sn) increased.

作者: Jin Peng Fengshun Wu Hui Liu Longzao Zhou Qilin Pan

作者单位: Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan, Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan, Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan,

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 1023-1026

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）