Instability and Failure Analysis of Film-substrate Structure under Electrical Loading
Delamination between the film line and the substrate is a main influence factor for instability and failure of the filmsubstrate structure, which exists widely in the large scale integrated circuit. The Buckle-driven delamination of constantan film line on polymer substrate under electrical loading was investigated in this paper. The post-buckling theory for beam was introduced to quantitatively analyze the residual strain and the residual stress. The maximal tensile stress and the maximal compressive stress of the buckled film line was found to be 1.69GPa and 2.03GPa respectively, after bearing 3.14×108A/m2 dc for 370.7 hours. The maximal compressive axial stress was 0.17GPa, showing the bending stress contributes to the majority of the residual stress of the film line. The instability and the failure behavior of the filmsubstrate structure were studied.
Qinghua Wang Huimin Xie Jia Liu Xue Feng Fulong Dai
AML, Department of mechanics and engineering, Tsinghua UniversityTsinghua University, Beijing 100084 AML, Department of mechanics and engineering, Tsinghua University Tsinghua University, Beijing 10008
国际会议
北京
英文
1027-1029
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）