Adhesion Behavior between Epozy Molding Compound and Different Leadframes in Plastic Packaging
Adhesion has been identified as one of the key elements in solving failure problems in electronic packaging. Understanding and improving the adhesion between epoxy molding compound (EMC) and leadframes is thought to be a key step towards improving package performance. The objective of this work was to study the effect on adhesion behavior and delamination of plastic packages using various metal coated leadframes that had been subjected to preconditions. In this work, the effects of moisture absorption testing and reflow process on the interface adhesion strength of the EMC/metal leadframes were studied. Three kinds of metal coated leadframes were used: copper, silver coated copper and nickel/palladium/gold coated copper. Adhesion strength was measured using the tab pull test. These data were correlated to some extent with the findings of package delamination observed by the C-mode Scanning Acoustic Microscope (C-SAM). Scanning Electron Microscopy (SEM) and Energy Dispersive Spectroscopy (EDS) were employed to characterize the surface of EMC and metal leadframes after separation along the vertical plane.
Li Xu Xiuzhen Lu Johan Liu Xinyu Du Yan Zhang Zhaonian Cheng
Key Laboratory of Advanced Display and System Applications, Ministry of Educationand SMIT Center, Sc Key Laboratory of Advanced Display and System Applications, Ministry of Educationand SMIT Center, Sc Henkel Corporation, 15350 Barranca Pkwy, Irvine CA 92618, USA SMIT Center & Bionano Systems Laboratory, Department of Microtechnology and Nanoscience, Chalmers Un
国际会议
北京
英文
1039-1042
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）