Influencing Factors and Solutions for Ball Short during Wire Bonding

摘要：

During cold season (from November to April), ball short failure caused by ball deformation often occurred and pad corrosion during PCT is also detected simultaneously, so it is urgent to find root cause and assure wire bond quality. The paper reveals that ball deformation and pad corrosion are mainly caused by S and Cl in atmosphere composition. The solution of adding chemical filter is presented and a minienvironment is setup to confirm efficiency, finally ball deformation and PCT failures are eliminated.

作者: Zhong Meng Yusheng Feng Sunggug Lee

作者单位: Samsung Electronics (Suzhou) Semiconductor Co., Ltd. (SESS)

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 1075-1078

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）