Microstructure Changes and Compound Growth Dynamic at Lead-free/Cu Interface under Different Conditions
The atom diffusion and growth behavior of intermetallic compound (IMC) at Sn3.5Ag0.5Cu/Cu interfaces under isothermal aging and thermal-shearing cycling conditions were investigated. The results show that the morphology of Cu6Sn5 IMCs formed at Sn3.5Ag0.5Cu/Cu interface changed gradually from scallop-like to chunk-like, and IMCs thickness developed with the isothermal aging and thermalshearing cycling times increasing. Furthermore, Cu6Sn5 IMC growth rate under the thermal-shearing cycling condition was higher than that of under isothermal aging. Compared to isothermal aging condition, only one Cu6Sn5 layer was formed and developed at the interface between SnAgCu solder and Cu substrate after 720 cycles. IMC growth dynamic equation is Y=Kε√DεCut=Kη√DηCut with Kη is about 10-5 μm2/s under isothermal aging, and that is Y=y0+Kη√DηCut under the thermal-shearing cycling condition with dynamic parameter Kη=√2(Cη/εη-Cη/βη)1/2/(Cη/βη-Cβ/ηβ)1/2 is about 10-5 to 10-4 μm2/s.
Lihua Qi Jihua Huang Jing Niu Long Yang Yaorong Feng Xingke Zhao Hua Zhang
School of Material Science and Technology, University of Science and Technology Beijing Tubular Good School of Material Science and Technology, University of Science and Technology Beijing Tubular Goods Research Center of CNPC
国际会议
北京
英文
1083-1087
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）