Quality and Reliability Challenges for Ultra Mobile Computing and Communication Application Processor Packaging

摘要：

Market drivers, technology scaling and integration trends of application processor packaging are first presented. Component level and board level quality and reliability challenges are then discussed in the areas of thin die and thin core package warpage, lead free flip chip die to package interconnect mechanical integrity, and lead free package to motherboard solder joint reliability. Challenges from package qualification methodology and use condition are also addressed.

作者: Dongming He Wonjae Kang

作者单位: Quality and Reliability EngineeringIntel CorporationPrairie City Road, Folsom, CA 95630, USA Quality and Reliability Engineering Intel Corporation Prairie City Road, Folsom, CA 95630, USA

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 1104-1112

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）