会议专题

Numerical Simulation on Variable Width Multi-Channels Heat Sinks with Non-uniform Heat Source

The micro-channel heat sink (MCHS) is almost using a separate production of silicon or copper MCHS, which is indirectly on package dimensions. Using this package structure of the heat sink, the temperature of its central region is much higher than the surrounding region. It makes the surface of the hot load non-uniformly. At present, most of the studies have adopted the uniform thermal load, regardless of the way through trial or through the means of simulation. Traditional micro-channel has effects on treating the uniform thermal load, however, its structure needs to be further improved in order to reduce the hot concentrated caused by the non-uniformity. Few papers have done the research about the non-uniform heat source distributions. In this paper, the non-uniform heat source distributions are studied in the micro-channel heat sink (MCHS) cooler. The simulation model is established to analyze the temperature and pressure distributing of the MCHS with different channel widthdimensions. Water is chosen as the coolant for its superior hot properties and the velocity range is from 0.01m/s to 10m/s. With the simulation of the computation fluid dynamics software FLUENT, results show that the non-equal displacement of fins can effectively decrease the temperature rise under the same conditions cooling a non-uniform heat source.

Xiaojing Wang Wen Zhang Hongjun Liu Ling Chen, Zongshuo Li

Shanghai UniversityShanghai University, 224mail box, 149 Yan Chang RD. Shanghai, 20072, China Shanghai University Shanghai University, 224mail box, 149 Yan Chang RD. Shanghai, 20072, China

国际会议

2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

北京

英文

1155-1158

2009-08-10(万方平台首次上网日期,不代表论文的发表时间)