Corrosion Characterization of Sn37Pb Solders and With Cu Substrate Soldering Reaction in 3.5wt.％ NaCl Solution

摘要：

The electrochemical corrosion behavior of Sn37Pb solder, Cu6Sn5, Cu3Sn and Cu in 3.5％ NaCl solution was investigated by using Galvanic corrosion testing, potentiodynamic polarization methods. The galvanic current densities for Sn37Pb solder in 3.5wt.％ NaCl solution are 38, 16 and 5μA/cm2 for Cu3Sn, Cu, and Cu6Sn5, respectively. Polarization studies revealed that an increase in Cu content and formation of IMCs shifted the corrosion potential (Ecorr.) towards more noble values and increased the corrosion current density (Icorr.).

作者: L. C. Tsao

作者单位: Department of Materials Engineering, Pingtung University of Science & Technology, Taiwan, China 1, Hseuhfu Road, Neipu, Pingtung 91201, Taiwan, China

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 1164-1166

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）