会议专题

Effect of Bonding Temperature and Power Setting on Transducer Velocity Using Principal Components Analysis in Thermosonic Bonding

In thermosonic wire bonding process, the bonding power setting and bonding temperature are important factors to the vibration of transducer system, which plays a crucial role in bonding formation. In a number of bonding experiments which were carried out at different power setting and temperature, vibration velocity at the tip of transducer was monitored. Vibration Signals were analyzed by wavelet decomposition and principal component analysis (PCA). The results show that principal component analysis is an effective method for vibration velocity analysis. The first principal component contains the most variability. And the component loadings on the major indexes are much larger than those on others, which can be neglected. These experimentally obtained data and results could conduce to further studying about the interaction of bonding parameters.

Ya’nan Zhang Lei Han

Key Laboratory of Modern Complex Equipment Design and Extreme manufacturing, Central South Universit Key Laboratory of Modern Complex Equipment Design and Extreme manufacturing, Central South Universit

国际会议

2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

北京

英文

1171-1175

2009-08-10(万方平台首次上网日期,不代表论文的发表时间)