Failure Evaluation of Flezible-Rigid PCBs by Thermo-Mechanical Simulation
In this present work the finite element method has been used for the simulation models in order to develop tools for the early stages of product design. The objective is to develop simulation models for Flexible Printed Circuits Boards (PCBs) in a flex-rigid concept in the shape of a wrist device to evaluate its critical stress and strain when this device is submitted to thermal loading considering FR4 and Polyimide substrates as the constitutive materials of the board with BGA attached components. The critical points are the mismatch of the coefficient of thermal expansion of different materials as well as the thermoset viscoelastic nature of the polyimide. In the end of this present study it will be shown that additional research should be done to the final product. In this paper we will show the preliminary results of strain and stress distribution induced by thermo loading using a commercial finite element package.
Luciano Arruda Quayle Chen Jairo Quintero
Instituto Nokia de Tecnologia Universidade Estadual do AmazonasRodovia Torquato Tapaj(o)s, 7200, Col Nokia Research Center (NRC) Instituto Nokia de Tecnologia
国际会议
北京
英文
1201-1205
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）