Thermal-Mechanical Failure and Life Analysis on CBGA Package used for Great Scale FPGA Chip

摘要：

CBGA (Ceramic Ball Grid Array) is one kind of advanced package for FPGA, which can fulfill the demands of high interconnect density, high thermal and electronic performance, high chip-assembling yields, high reliability. But in multiple loading environments, CBGA has the invalidation mode of solder joint thermal-mechanical failure, which will influence the long term reliability of FPGA circuits. But there is few research on the China native made CBGA package. In this paper research of finite element analysis and solder joint fatigue predictive equation have been made on some of CBGA packages, and some failure prediction and ATC test results have been given.

作者: Wenchang Li Xiaojun Zhang

作者单位: State Key Laboratory of Electronic Thin Films and Integrated Devices, UESTC,No. 4 Section 2, North J Hebei Semiconductor Research Institute, No. 113 Hezuo, Road, Shijiazhuang, P. R. China

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 1216-1219

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）