Study of Isothermal Bending Fatigue Test

摘要：

TC test is very important for solder joint reliability, but the test time for TC test is very long, normally it cost about 2 months. In order to shorten TC test time, many researchers study the new test method to replace traditional TC test, such as bending fatigue test. However, theres still some limit for this field study. Considering the actual user condition, the final product not only experience mechanical loading, but also thermal loading. Therefore, isothermal bending test (-25℃, 25℃, 75℃, 125℃) were studied to research the relationship of lifetime and failure mechanism between TC test and bending fatigue test. ANSYS was used to simulate isothermal bending fatigue test and also compare with traditional TC test.

作者: Minyi Lou Long Wen Zhengrong Chen Jianwei Zhou Qian Wang Jaisung Lee

作者单位: Samsung Semiconductor (China) R&D Co., LtdNo. 15, Jin Ji Hu Road, Suzhou Industrial Park, Suzhou, Ch Samsung Semiconductor (China) R&D Co., Ltd No. 15, Jin Ji Hu Road, Suzhou Industrial Park, Suzhou, C

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 1246-1255

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）