Testing Failure of Solder-Joints by ESPI on Board-Level Surface Mount Devices

摘要：

Fast and nondestructive welding quality inspection on board-level BGA and PLCC devices is relatively difficult due to small size and special location of solder joints. In this study, a novel testing method combing Electronic Speckle Pattern Interferometry (ESPI) and Finite Element Analysis (FEA) was proposed to detect joint failures in surface-mount devices. ESPI technology was utilized to compare the difference of assembly deformation between damage solder joints and the good counterparts under simple mechanical loadings. Using finite element analysis, the location and failure modes of damage joints were identified. The testing results from pseudo BGA sample and real PLCC device illustrated the validity of the method; especially for testing corner solder joints.

作者: Yunxia Gao Jun Wang

作者单位: Department of Materials Science, Fudan UniversityNo. 220, Handan Road, Shanghai 200433, China Department of Materials Science, Fudan University No. 220, Handan Road, Shanghai 200433, China

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 1256-1259

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）