Study on Shear Strength and Jc of EMC/Cu Interface with Cu Ozidation and Moisture Absorption
In plastic power devices, the interfaces of Cu/EMC are most likely to delaminate under thermal loading, especially when moisture diffuses into the interface through EMC. In this work, the bare die samples were fabricated in standard commercial process. Shear test of Cu/EMC interface was designed to measure the strength of the interface with different lead-frame oxidation and moisture absorption time. The samples with pre-cracks on Cu/EMC interfaces were studied by the same shear test method and the critical value of J-integral was investigated by FEA (Finite Element Analysis). The results indicated that the shear strength of Cu/EMC interfaces and the value of J-integral declined dramatically with moisture absorption time. However, the effect of leadframe oxidation is complex. The 2-D analysis of power device showed that the small initial crack, as small as 0.13 mm, will propagate along Cu/EMC interface when temperature is decreased to -55℃.
Xing FANG Qiang FANG Jun WANG Hongkun YU Xuefeng SHAO
Department of Materials Science, Fudan UniversityNo. 220, Handan Road, Shanghai 200433, China Fairchild Semiconductor (Suzhou) Co., Ltd, China
国际会议
北京
英文
1260-1263
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）