XPS Study on Epozy/Ni Interface

摘要：

The interface between epoxy molding compound (EMC) and nickel has been investigated by using X-ray photoelectron spectroscopy (XPS). The change of binding energy of main element indicated that there was interaction between metallic and non-metallic element and new bond might exist in the interface.

作者: Li Liu Wenting Xv

作者单位: Dept. of Polymer Science, School of Material Science and Engineering Technology, Shanghai Univ.Cheng Dept. of Polymer Science, School of Material Science and Engineering Technology, Shanghai Univ. Chen

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 1264-1265

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）