Delamination in thermohyperelastic plastic IC packaging material due to thermal load and moisture
Lamination failure as popcorn form of plastic electronic packages under thermal stress induced by heat mismatch and vapor pressure induced by the moisture during the solder-reflow process is studied. When plastic electronic packages are made of thermohyperelastic materials, using the theory of cavity formation and unstable void growth in incompressible hyper-elastic material, we gained a analytical relationship between void growth and the sum of the vapor pressure and thermal stress. Numerical analyses show that plastic electronic packages will produce popcorn failure when the vapor pressure maintains saturation state during the solder reflow process on condition that plastic electronic packages absorb a lot of moisture; popcorn failure wont occur when the moisture in voids is in single vapor phase during the solder-reflow process on condition that plastic electronic packages absorb little moisture.
thermohyperelastic material popcorn failure vapor pressure
Li Zhigang Yang Xuexia Shu Xuefeng
Institute of Applied Mechanics Taiyuan University of Technology Taiyuan,Shanxi 030024,P.R.China
国际会议
长沙
英文
1719-1723
2009-04-11（万方平台首次上网日期，不代表论文的发表时间）