A Ka Band LTCC-based Small Encapsulated Transceiver Module
With the development of the millimeter-wave system technology, system on chip (SOC) and system on package (SOP) millimeter wave system become an important direction. Low-temperature co-fired ceramics (LTCC) technology has been widely used in the design because of its relatively high dielectric constant, the technics stability and the three-dimention (3D) system on package in the millimeter-wave transceiver design. In this paper, we describes a small Ka-band transceiver using LTCC technology and its application in a small channel extension. All part of the millimeter-wave circuit are built on Ferro A6 tape in a standard multi-layer LTCC technology, and be hermetic encapsulated with tungsten copper and kovar. This transceiver includes the internal components of a receiving channel and a transimitting channel, which are switched by a MMIC switch chip, and share a fourth subharmonic image rejection mixer which achieve the downconvert frequency image rejection and upconvert sideband constrain at the same time. The circuit in this transceiver is high-density integrated, system integration package (SOP) of the millimeter-wave MMIC chips and other passive circuit. In this paper it is described in detail on the principle of transceiver, LTCC waveguide-microstrip transition, the fourth subharmonic image rejection mixer, RF bandpass filters, LO bandstop filter and other passive circuits and the hermetic packaging technology of the small transceiver module. Transceiver has the entire volume of 32mm×45mm×6 mm. Working in the 400MHz bandwidth in the receiver gain measured greater than 35 dB, noise figure of less than 5 dB, image frequency compression of greater than 30 dB, output power greater than 21 dBm. The result provides a good high-volume production consistency of circuit, low-cost, easy assembly, with a high value of the LTCC encapsulated transceiver module.
Ye Yuan Yubo Cui Shengchang Zhang Kai Zhang
The 10th Institute of Chinese Electronic Technology Corporation P.O.Box 94-13,Chengdu 610036,China
国际会议
Progress in Electromagnetics Research Symposium 2009(2009年电磁学研究新进展学术研讨会)(PIERS 2009)
北京
英文
1368-1371
2009-03-23（万方平台首次上网日期，不代表论文的发表时间）