Evolution of Wafer Inspection and Review Methodology
Since the introduction of KLA 2000 series systems in mid 1980, Semiconductor manufacturing has widely adopted automated wafer inspection to detect defects during manufacturing to mitigate excursion and to reduce overall defect density. While the earlier emphasis in yield management was to detect the smallest defect possible, current environment calls for changes in both inspection and post processing technique that lead to identification of yield relevant defects in an efficient manner. Industry calls for intelligent way of inspecting the most critical areas on a device with high sensitivity and post inspection technique that utilizes advance techniques to generate defect pareto that highlights most important issues in defect data. Such methods are needed to meet both technical and financial goals of semiconductor companies.
Ellis Chang Allen Park
KLA-Tencor Corporation,Milpitas,California 95035,USA
国际会议
上海
英文
183-186
2009-03-19（万方平台首次上网日期，不代表论文的发表时间）