Challenges and Opportunities for Optical CD Metrology in Future Lithography Process
As the IC industry is progressing towards 32 nm technology, Optical CD metrology will play an important role to help address many challenges in process control. OCD has the unique capability to characterize many critical dimensions in-line for complicated device structures nondestructively. Future process integration requires frequent W2W monitoring and feed forward/feedback control for critical layers. This makes integrated metrology (IM) a key option in process tools, and currently OCD is the only viable option for CD IM. In order to seize these opportunities, many improvements for OCD are need. Optical tools may need to be further optimized for better CD metrology performance. OCD modeling software should be able to model complicated structures and greatly boost ease of use. Furthermore, a well developed IM-SA OCD common platform is needed as the foundation for advanced process and equipment control.
Junwei Bao Jason Ferns Youxian Wen
Timbre Technologies,Inc. 2953 Bunker Hill Lane,Suite 301,Santa Clara,CA 95054,USA Timbre Technologies,Inc.2953 Bunker Hill Lane,Suite 301,Santa Clara,CA 95054,USA
国际会议
上海
英文
315-320
2009-03-19（万方平台首次上网日期，不代表论文的发表时间）