The Destructive Wire Bond Pull Test Methodology for the Ultra Low Loop Application on Thinner Die Package
The destructive bond pull test is the most common methodology for quality control of the wire bond process on assembly manufacturing. It was introduced in the 1960s and it is described in U.S military specifications1). However, compared to 40 years ago, the wire bonding process has made rapid progress. Today, some of the hottest processes that System-In-Package (SIP), Package-On-Package (PoP) and 3D package require the Ultra Low Loop (ULL, <75 μm height) process on thinner die (<100μm) 2). Therefore, the legacy pull test is not sufficient to apply for the ULL and thinner die applications to meet criteria. Because wire breaking values and the failure mode are significantly different by the loop height, die thickness and the position of the wire pull hook3). This paper is presented in order to introduce a universal wire pull test specification and methodology for the ULL on thinner die application.
Bob Chylak Oranna Yauw O Dal Kwon Kuan Fang Lee
VP of Global Process Engineering,Kulicke & Soffa,1005 Virginia Drive,Ft.Washington,PA 19034,USA Manager of Process Development Engineering,Kulicke & Soffa,6 Serangoon NorthAve 5,Singapore 554910 Sr. Staff Engineer of Process Development Engineering,Kulicke & Soffa,6 SerangoonNorth Ave,554910 Si Advanced Process Engineer of Process Development Engineering,Kulicke & Soffa,6Serangoon North Ave 5,
国际会议
上海
英文
803-812
2009-03-19（万方平台首次上网日期，不代表论文的发表时间）